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available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 4328909 (800) 4116596 +44 2392232392 model x 3 c 19 p 1 - 05 s rev b 5db directional coupler description the x3c19p105s is a low profile, high performance 5db directional coupler in a new easy to use, manufacturing friendl y surface mount package. it is designed for dc, wcdma, lte and pcs applications. the x3c19p105s is designed particularly for nonbi nary split and combine in high power amplifiers, e.g. used along w ith a 3db to get a 3 way, plus other signal distribution applications wh ere low insertion loss is required. it can be used in high power applicati ons up to 70 watts. parts have been subjected to rigorous qualification testing and they are manufactured using materials with coefficients of t hermal expansion (cte) compatible with common substrates such as fr4 , g10, rf35, ro4003 and polyimide. produced with 6 of 6 rohs com pliant tin immersion finish electrical specifications ** features: ? 1700-2000mhz ? dcs,pcs, wcdma and lte ? high power ? very low loss ? tight coupling ? high directivity ? production friendly ? tape and reel ? lead free frequency mean coupling insertion loss vswr phase balance mhz db db max max : 1 degrees 17002000 5.0 0.3 0.15 1.22 90 4.0 18051880 5.0 0.2 0.13 1.15 90 2.0 19301990 5.0 0.2 0.14 1.15 90 2.0 directivity frequency sensitivity power ? jc operating temp. db min db max avg. cw watts oc/watt oc 20 0.25 70 20 55 to +95 23 0.05 70 20 55 to +95 23 0.05 70 20 55 to +95 **specification based on performance of unit proper ly installed on anaren test board 541470001. refe r to specifications subject to change without notice. r efer to parameter definitions for details. mechanical outline
usa/canada: toll free: europe: (315) 4328909 (800) 4116596 +44 2392232392 available on tape and reel for pick and place manufacturing. model x 3 c 19 p 1 - 05 s rev b directional coupler pin configuration the x3c19p105s has an orientation marker to denote pin 1. once port one has been identified the othe r ports are known automatically. please see the chart below fo r clarification: pin 1 pin 2 pin 3 pin 4 input isolated direct coupled isolated input coupled direct direct coupled input isolated coupled direct isolated input note: the direct port has a dc connection to the in put port and the coupled port has a dc connection t o the isolated port.
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 4328909 (800) 4116596 +44 2392232392 model x 3 c 19 p 1 - 05 s rev b insertion loss and power derating curves typical insertion loss derating curve for x3c19p10 5 0.12 0.11 0.1 0.09 0.08 0.07 0.06 0.05 0.04 100 50 0 50 100 150 200 temperature of the part ( o c) insertion loss (db) typical insertion loss (f=1880mhz) typical insertion loss (f=1990mhz) typical insertion loss (f=2000mhz) x3c19p105 power derating curve 0 20 40 60 80 100 120 140 0 50 100 150 200 mounting interface temperature ( o c) power (watts) 1700 2000mhz 70 95 insertion loss derating: the insertion loss, at a given frequency, of a grou p of couplers is measured at 25 c and then averaged. the measurements are performed under small signal conditions (i.e. using a vector network analyzer). the process is repeated at 85 c and 150 c. a best fit line for the measured data is computed and then plotted from 55 c to 150 c. power derating: the power handling and corresponding power derating plots are a function of the thermal resistance, mou nting surface temperature (base plate temperature), maxim um continuous operating temperature of the coupler, an d the thermal insertion loss. the thermal insertion loss is defined in the power handling section of the data s heet. as the mounting interface temperature approaches th e maximum continuous operating temperature, the power handling decreases to zero.
usa/canada: toll free: europe: (315) 4328909 (800) 4116596 +44 2392232392 available on tape and reel for pick and place manufacturing. model x 3 c 19 p 1 - 05 s rev b typical performance (-55c, 25c and 95c): 1700-2 000 mhz 1700 1750 1800 1850 1900 1950 2000 60 50 40 30 20 10 0 frequency (mhz) return loss (db) return loss for x3c19p105s(feeding port1) 55oc 25oc 95oc 1700 1750 1800 1850 1900 1950 2000 60 50 40 30 20 10 0 frequency (mhz) return loss (db) return loss for x3c19p105s(feeding port2) 55oc 25oc 95oc 1700 1750 1800 1850 1900 1950 2000 60 50 40 30 20 10 0 frequency (mhz) return loss (db) return loss for x3c19p105s(feeding port3) 55oc 25oc 95oc 1700 1750 1800 1850 1900 1950 2000 60 50 40 30 20 10 0 frequency (mhz) return loss (db) return loss for x3c19p105s(feeding port4) 55oc 25oc 95oc
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 4328909 (800) 4116596 +44 2392232392 model x 3 c 19 p 1 - 05 s rev b typical performance (-55c, 25c and 95c): 1700-2 000 mhz 1700 1750 1800 1850 1900 1950 2000 5.5 5.4 5.3 5.2 5.1 5 4.9 4.8 4.7 4.6 4.5 frequency (mhz) coupling (db) coupling for x3c19p105s(feeding port1) 55oc 25oc 95oc 1700 1750 1800 1850 1900 1950 2000 60 50 40 30 20 10 0 frequency (mhz) directivity (db) directivity for x3c19p105s(feeding port1) 55oc 25oc 95oc 1700 1750 1800 1850 1900 1950 2000 0.2 0.18 0.16 0.14 0.12 0.1 0.08 0.06 0.04 0.02 0 frequency (mhz) insertion loss (db) insertion loss for x3c19p105s(feeding port1) 55oc 25oc 95oc 1700 1750 1800 1850 1900 1950 2000 4 3 2 1 0 1 2 3 4 frequency (mhz) phase balance (db) phase balance for x3c19p105s(feeding port1) 55oc 25oc 95oc
usa/canada: toll free: europe: (315) 4328909 (800) 4116596 +44 2392232392 available on tape and reel for pick and place manufacturing. model x 3 c 19 p 1 - 05 s rev b definition of measured specifications parameter definition mathematical representation vswr (voltage standing wave ratio) the impedance match of the coupler to a 50 system. a vswr of 1:1 is optimal. vswr = min max v v vmax = voltage maxima of a standing wave vmin = voltage minima of a standing wave return loss the impedance match of the coupler to a 50 system. return loss is an alternate means to express vswr. return loss (db)= 20log 1 - vswr 1 vswr + mean coupling at a given frequency ( n ), coupling is the input power divided by the power at the coupled port. mean coupling is the average value of the coupling values in the band. n is the number of frequencies in the band. coupling (db) = ? ?? ? ? ?? ? = ) ( ) ( log 10 ) ( n cpl n in n p p c mean coupling (db) = n c n n n = 1 ) ( insertion loss the input power divided by the sum of the power at the two output ports. 10log direct cpl in p p p + directivity the power at the coupled port divided by the power at the isolated port. 10log iso cpl p p phase balance the difference in phase angle between the two output ports. phase at coupled port C phase at direct port frequency sensitivity the decibel difference between the maximum in band coupling value and the mean coupling, and the decibel difference between the minimum in band coupling value and the mean coupling. max coupling (db) C mean coupling (db) and min coupling (db) C mean coupling (db)
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 4328909 (800) 4116596 +44 2392232392 model x 3 c 19 p 1 - 05 s rev b notes on rf testing and circuit layout the x3c19p105s surface mount couplers require the use of a test fixture for verification of rf perfor mance. this test fixture is designed to evaluate the coupler in the same environment that is recommended for insta llation. enclosed inside the test fixture, is a circuit boar d that is fabricated using the recommended footprin t. the part being tested is placed into the test fixture and pressure is applied to the top of the device using a pneuma tic piston. a four port vector network analyzer is connected to the fi xture and is used to measure the sparameters of th e part. worst case values for each parameter are found and compar ed to the specification. these worst case values ar e reported to the test equipment operator along with a pass or fa il flag. see the illustrations below. 3 db and 5db test board test board in fixture test station
usa/canada: toll free: europe: (315) 4328909 (800) 4116596 +44 2392232392 available on tape and reel for pick and place manufacturing. model x 3 c 19 p 1 - 05 s rev b the effects of the test fixture on the measured dat a must be minimized in order to accurately determin e the performance of the device under test. if the line i mpedance is anything other than 50 and/or there is a discontinuity at the microstrip to sma interface, there will be e rrors in the data for the device under test. the te st environment can never be perfect, but the procedure used to build and evaluate the test boards (outlined below) demo nstrates an attempt to minimize the errors associated with test ing these devices. the lower the signal level that is being measured, the more impact the fixture errors will h ave on the data. parameters such as return loss and isolation/directivity, which are specified as low a s 27db and typically measure at much lower levels, will present the greatest measurement challenge. the test fixture errors introduce an uncertainty to the measured data. fixture errors can make the per formance of the device under test look better or worse than it actu ally is. for example, if a device has a known retur n loss of 30db and a discontinuity with a magnitude of C35db is introd uced into the measurement path, the new measured re turn loss data could read anywhere between C26db and C37db. t his same discontinuity could introduce an insertion phase error of up to 1 . there are different techniques used throughout the industry to minimize the affects of the test fixtur e on the measurement data. anaren uses the following design and deembedding criteria: ? test boards have been designed and parameters spec ified to provide trace impedances of 50 1 . furthermore, discontinuities at the sma to micros trip interface are required to be less than C35db and insertion phase errors (due to difference s in the connector interface discontinuities and the electrical line length) should be less than 0.50 from the median value of the four paths. ? a thru circuit board is built. this is a two por t, microstrip board that uses the same sma to microstrip interface and has the same total length (insertion phase) as the actual test board. the thru board must meet the same stringent requireme nts as the test board. the insertion loss and insertion phase of the thru board are measure d and stored. this data is used to completely deembed the device under test from the test fixture. the deembedded data is available in sparameter form on the anaren website (www.anaren.com). note : the sparameter files that are available on the anaren.com website include data for frequencies tha t are outside of the specified band. it is important to n ote that the test fixture is designed for optimum p erformance through 2.3ghz. some degradation in the test fixture perfor mance will occur above this frequency and connector interface discontinuities of C25db or more can be expected. t his larger discontinuity will affect the data at fr equencies above 2.3ghz. circuit board layout the dimensions for the anaren test board are shown below. the test board is printed on rogers ro4003 m aterial that is 0.032 thick. consider the case when a different material is used . first, the pad size must remain the same to accommodate the part. but, if the material thicknes s or dielectric constant (or both) changes, the rea ctance at the interface to the coupler will also change. second, the linewidth required for 50 will be different and this will introduce a step in the line at the pad where the coupler int erfaces with the printed microstrip trace. both of these conditions will affect the performance of the part. to achieve the specified performance, serious atten tion must be given to the design and layout of the circuit environment in whi ch this component will be used. if a different circuit board material is used, an a ttempt should be made to achieve the same interface pad reactance that is present on the anaren ro4003 test board. wh en thinner circuit board material is used, the grou nd plane will be closer to the pad yielding more capacitance for the same size interface pad. the same is true if th e dielectric constant of the circuit board material is higher th an is used on the anaren test board. in both of the se cases, narrowing the line before the interface pad will in troduce a series inductance, which, when properly t uned, will compensate for the extra capacitive reactance. if a thicker circuit board or one with a lower dielectr ic constant is used,
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 4328909 (800) 4116596 +44 2392232392 model x 3 c 19 p 1 - 05 s rev b the interface pad will have less capacitive reactan ce than the anaren test board. in this case, a wide r section of line before the interface pad (or a larger interface pad ) will introduce a shunt capacitance and when prope rly tuned will match the performance of the anaren test board. notice that the board layout for the 3db and 5db co uplers is different from that of the 10db and 20db couplers. the test board for the 3db and 5db couplers has all fou r traces interfacing with the coupler at the same a ngle. the test board for the 10db and 20db couplers has two traces approaching at one angle and the other two traces at a different angle. the entry angle of the traces has a significant imp act on the rf performance and these parts have been optimized for the layout used on the test boar ds shown below. 3 db and 5db test board testing sample parts supplied on anaren test boards if you have received a coupler installed on an anar en produced microstrip test board, please remember to remove the loss of the test board from the measured data. the loss is small enough that it is not of concern for return loss and isolation/directivity, but it should certainly be c onsidered when measuring coupling and calculating t he insertion loss of the coupler. an sparameter file for a thru bo ard (see description of thru board above) will be supplied upon request. as a first order approximation, one should consider the following loss estimates: frequency band avg. ins. loss of test board @ 25 c 869-894 mhz ~0.064db 925-960 mhz ~0.068db 1805-1880 mhz ~0.119db 1930-1990 mhz ~0.126db 2110-2170 mhz ~0.136db the loss estimates in the table above come from roo m temperature measurements. it is important to note that the loss of the test board will change with temperature . this fact must be considered if the coupler is to be evaluated at other temperatures.
usa/canada: toll free: europe: (315) 4328909 (800) 4116596 +44 2392232392 available on tape and reel for pick and place manufacturing. model x 3 c 19 p 1 - 05 s rev b peak power handling highpot testing of these couplers during the quali fication procedure resulted in a minimum breakdown voltage of 1.46kv (minimum recorded value). this voltage level corresponds to a breakdown resistance capable of h andling at least 12db peaks over average power levels, for ver y short durations. the breakdown location consisten tly occurred across the air interface at the coupler contact pad s (see illustration below). the breakdown levels at these points will be affected by any contamination in the gap area ar ound these pads. these areas must be kept clean for optimum performance. it is recommended that the user test f or voltage breakdown under the maximum operating co nditions and over worst case modulation induced power peakin g. this evaluation should also include extreme envi ronmental conditions (such as high humidity). orientation marker a printed circular feature appears on the top surfa ce of the coupler to designate pin 1. this orientat ion marker is not intended to limit the use of the symmetry that thes e couplers exhibit but rather to facilitate consist ent placement of these parts into the tape and reel package. this en sures that the components are always delivered with the same orientation. refer to the table on page 2 of the da ta sheet for allowable pin configurations. test plan xinger iii couplers are manufactured in large panel s and then separated. all parts are rf small signal tested and dc tested for shorts/opens at room temperature in the fixture described above . (see qualification flow chart section for details on the accelerated life test procedures .)
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 4328909 (800) 4116596 +44 2392232392 model x 3 c 19 p 1 - 05 s rev b power handling the average power handling (total input power) of a xinger coupler is a function of: ? internal circuit temperature. ? unit mounting interface temperature. ? unit thermal resistance ? power dissipated within the unit. all thermal calculations are based on the following assumptions: ? the unit has reached a steady state operating cond ition. ? maximum mounting interface temperature is 95 o c. ? conduction heat transfer through the mounting inte rface. ? no convection heat transfer. ? no radiation heat transfer. ? the material properties are constant over the oper ating temperature range. finite element simulations are made for each unit. the simulation results are used to calculate the u nit thermal resistance. the finite element simulation requires the following inputs: ? unit material stackup. ? material properties. ? circuit geometry. ? mounting interface temperature. ? thermal load (dissipated power). the classical definition for dissipated power is te mperature delta ( t) divided by thermal resistance (r). the dissipated power (p dis ) can also be calculated as a function of the total input power (p in ) and the thermal insertion loss (il therm ): ) ( 10 1 10 w p r t p therm il in dis ? ?? ? ? ?? ? ? ? = = ? (1) power flow and nomenclature for an x style couple r is shown in figure 1.
usa/canada: toll free: europe: (315) 4328909 (800) 4116596 +44 2392232392 available on tape and reel for pick and place manufacturing. model x 3 c 19 p 1 - 05 s rev b pin 1 pin 4 input port coupled port direct port isolated port p in p out (rl) p out (iso) p out (cpl) p out (dc) figure 1 the coupler is excited at the input port with p in (watts) of power. assuming the coupler is not ide al, and that there are no radiation losses, power will exit the coupler at all four ports. symbolically written, p out(rl) is the power that is returned to the source because of impedance mismatc h, p out(iso) is the power at the isolated port, p out(cpl) is the power at the coupled port, and p out(dc) is the power at the direct port. at anaren, insertion loss is defined as the log of the input power divided by the sum of the power at the coupled and direct ports: note: in this document, insertion loss is taken to be a positive number. in many places, insertion lo ss is written as a negative number. obviously, a mere sign change equ ates the two quantities. ) db ( p p p log 10 il ) dc ( out ) cpl ( out in 10 ? ?? ? ? ?? ? + ? = (2) in terms of sparameters, il can be computed as fol lows: ) db ( s s log 10 il 2 41 2 31 10 ?? ? ?? ? + ? ? = (3) we notice that this insertion loss value includes t he power lost because of return loss as well as pow er lost to the isolated port. for thermal calculations, we are only interested in the power lost inside the coupler. since p out(rl) is lost in the source termination and p out(iso) is lost in an external termination, they are not b e included in the insertion loss for thermal calculations. therefore, we define a new i nsertion loss value solely to be used for thermal c alculations: ) ( log 10 ) ( ) ( ) ( ) ( 10 db p p p p p il rl out iso out dc out cpl out in therm ? ?? ? ? ?? ? + + + ? = (4)
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 4328909 (800) 4116596 +44 2392232392 model x 3 c 19 p 1 - 05 s rev b in terms of sparameters, il therm can be computed as follows: ) ( log 10 2 41 2 31 2 21 2 11 10 db s s s s il therm ?? ? ?? ? + + + ? ? = (5) the thermal resistance and power dissipated within the unit are then used to calculate the average tot al input power of the unit. the average total steady state input power (p in ) therefore is: ) ( 10 1 10 1 10 10 w r t p p therm therm il il dis in ? ?? ? ? ?? ? ? = ? ?? ? ? ?? ? ? = ? ? (6) where the temperature delta is the circuit temperat ure (t circ ) minus the mounting interface temperature (t mnt ): ) ( c t t t o mnt circ ? = (7) the maximum allowable circuit temperature is define d by the properties of the materials used to constr uct the unit. multiple material combinations and bonding techniqu es are used within the xinger iii product family to optimize rf performance. consequently the maximum allowable ci rcuit temperature varies. please note that the cir cuit temperature is not a function of the xinger case (t op surface) temperature. therefore, the case tempe rature cannot be used as a boundary condition for power handling calculations. due to the numerous board materials and mounting co nfigurations used in specific customer configuratio ns, it is the end users responsibility to ensure that the xinger iii coupler mounting interface temperature is maint ained within the limits defined on the power derating plots for the required average p ower handling. additionally appropriate solder composition is required to prevent reflow or fatigue failure at the rf ports. finally, reliabil ity is improved when the mounting interface and rf port temperatures are kep t to a minimum. the powerderating curve illustrates how changes in the mounting interface temperature result in conve rse changes of the power handling of the coupler.
usa/canada: toll free: europe: (315) 4328909 (800) 4116596 +44 2392232392 available on tape and reel for pick and place manufacturing. model x 3 c 19 p 1 - 05 s rev b mounting in order for xinger surface mount couplers to work optimally, there must be 50 transmission lines lea ding to and from all of the rf ports. also, there must be a very good ground plane underneath the part to ensur e proper electrical performance. if either of these two conditions is not satisfied, electrical performance may not meet published specifications. overall ground is improved if a dense population of plated through holes connect the top and bottom gro und layers of the pcb. this minimizes ground inductanc e and improves ground continuity. all of the xinger h ybrid and directional couplers are constructed from ceram ic filled ptfe composites which possess excellent elec trical and mechanical stability having x and y thermal coefficient of expansion (cte) of 1725 ppm/ o c. when a surface mount hybrid coupler is mounted to a printed circuit board, the primary concerns are; en suring the rf pads of the device are in contact with the c ircuit trace of the pcb and insuring the ground plane of n either the component nor the pcb is in contact with the rf signal. mounting footprint coupler mounting process the process for assembling this component is a conventional surface mount process as shown in figu re 1. this process is conducive to both low and high v olume usage. figure 1: surface mounting process steps storage of components: the xinger iii products are available in either an immersion tin or tinlead fi nish. commonly used storage procedures used to control oxidation should be followed for these surface moun t components. the storage temperatures should be hel d between 15 o c and 60 o c. substrate: depending upon the particular component, the circuit material has an x and y coefficient of thermal expansion of between 17 and 25 ppm/c. this coeffic ient minimizes solder joint stresses due to similar expa nsion rates of most commonly used board substrates such a s rf35, ro4003, fr4, polyimide and g10 materials. mounting to hard substrates (alumina etc.) is pos sible depending upon operational temperature requirements . the solder surfaces of the coupler are all copper p lated with either an immersion tin or tinlead exterior f inish. solder paste: all conventional solder paste formulations will work well with anarens xinger iii surface mou nt components. solder paste can be applied with stenci ls or syringe dispensers. an example of a stenciled solde r paste deposit is shown in figure 2. as shown in th e figure solder paste is applied to the four rf pads and the entire ground plane underneath the body of the part .
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 4328909 (800) 4116596 +44 2392232392 model x 3 c 19 p 1 - 05 s rev b figure 2: solder paste application coupler positioning: the surface mount coupler can be placed manually or with automatic pick and place mechanisms. couplers should be placed (see figure 3 and 4) onto wet paste with common surface mount techniques and parameters. pick and place systems must supply adequate vacuum to hold a 0.11 gram coupler. figure 3: component placement figure 4: mounting features example reflow: the surface mount coupler is conducive to most of todays conventional reflow methods. a low and high temperature thermal reflow profile are shown in fig ures 5 and 6, respectively. manual soldering of these comp onents can be done with conventional surface mount noncon tact hot air soldering tools. board preheating is highl y recommended for these selective hot air soldering methods. manual soldering with conventional irons should be avoided.
usa/canada: toll free: europe: (315) 4328909 (800) 4116596 +44 2392232392 available on tape and reel for pick and place manufacturing. model x 3 c 19 p 1 - 05 s rev b figure 5 C low temperature solder reflow thermal pr ofile figure 6 C high temperature solder reflow thermal p rofile
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 4328909 (800) 4116596 +44 2392232392 model x 3 c 19 p 1 - 05 s rev b qualification flow chart xinger iii product qualification visual inspection n=55 mechanical inspection n=50 solderability test n= 5 initial rf test n=50 visual inspection n=50 vtek testing n=45 visual inspection n=50 post v t ek test rf test n=50 visual inspection n=50 solder units to test board n=25 post solder visual inspection n=25 visual inspection n=25 rf test at 55c, 25c, 95c n=20 initial rf test board mounted n=25 visual inspection n=25 post resistance heat rf t est n=20 mechanical inspection n=20 voltage breakdown t est mil 202f, method 301 25c 5kv n=40 visual inspection n=50 c ontrol units rf test 25c only n=5 loose contr ol un its n= 5 resistance to solder mil 202g method 210f, condition k heat n=20 loose contr ol units n=5 control units n=5 loose control units n=5
usa/canada: toll free: europe: (315) 4328909 (800) 4116596 +44 2392232392 available on tape and reel for pick and place manufacturing. model x 3 c 19 p 1 - 05 s rev b contr ol u nits n=10 post voltage rf test n=50 therm al cycle 100 cycles 55 to 125c. dwell time= 30 min n=40 visual inspection n=50 control units n=10 visual inspection n=50 bake units for 1 hour at 100 to 120c n=40 125% power life test 72 hrs n= 3 post bake rf test n=50 visual inspection n=30 micr osection 3 test units 1 control f inal rf test @ 25c n= 2 5 microsection 2 life, 1 high power and 1 contr ol post moisture resistance rf test n=50 post t hermal rf test n=50 moisture resistance testing 25 to 65c for 2 hrs @ 90% humidity. soak for 168 hr s at 90% to 85% humidity. ramp temp to 25c in 2 hrs @ 90% humidity. then soak @ 10c for 3 hrs. n=40 post moisture resistance rf test n=50 control units n=10
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 4328909 (800) 4116596 +44 2392232392 model x 3 c 19 p 1 - 05 s rev b application information the x3c19p105s is an x style 5db coupler. port c onfigurations are defined in the table on page 2 of this data sheet and an example driving port 1 is shown below. note that this is not an h style coupler like the olde r 5db xinger couplers (such as the 1d13045 and 1a13055). the c hange was made to allow better placement of the ter mination resistors when the coupler is used in a serial spli tter/combiner network. ideal coupler operation 1 2 1v 0.562v ( - 5db) 0.827v - 90 ( - 1.65db) isolated port 4 3 the primary application for 5db couplers is in seri al splitting and combining networks. these networks are often employed when the combining of 3 amplifiers is requ ired. unlike corporate networks, serial networks ar e not limited to binary divisions (corporate networks are limited to 2 n number of splits, where n is an integer). serial networks can be designed with [3, 4, 5, .., n] splits, but have a practical limitation of about 8 splits. a 5db coupler is used in conjunction with a 3db cou pler to build 3way splitter/combiner networks. an ideal version of this network is illustrated below. note what is req uired; a 50% split (i.e. 3db coupler) and a 66% and 33% split (which is actually a 4.77db coupler, but due to losses in the system higher coupler values, such as 5db, are act ually better suited for this function). the design of this type of circ uit requires special attention to the losses and ph ase lengths of the components and the interconnecting lines. 3-way ideal serial splitter/combiner network 1/3 pin 2/3 pin 1/3 pin 1/3 pin g=1 g=1 g=1 pout 2/3 pin pin 1/3 pin 1/3 pin 1/3 pin 5 db (4.77) coupler 3 db coupler 3 db coupler 5 db (4.77) coupler * 50 termination * 50 termination * 50 termination * 50 termination *recommended terminations power (watts) model 8 rfp 060120a15z502 10 rfp c10a50z4 16 rfp c16a50z4 20 rfp c20n50z4 50 rfp c50a50z4 100 rfp c100n50z4 200 rfp c200n50z4
usa/canada: toll free: europe: (315) 4328909 (800) 4116596 +44 2392232392 available on tape and reel for pick and place manufacturing. model x 3 c 19 p 1 - 05 s rev b 2-way splitter for doherty power amplifer hybrid coupler can be used in doherty power amplifi er to split the input power into the desired power ratio and phase delay. in above symmetrical doherty power amplifier (main and peaking amplifier delivers equ al amount output power at max drive condition), 3db hy brid splits the input power into 1:1 ratio with 90 degree phase difference. when the peaking amplifier is off, or when peaking amplifier is dramatically different than main ampli fier due to bias, matching, difference between transistors, the 3db hybrid coupler does not see equally unmatch ed termination, the mismatch is then reflected not onl y to isolated port, but also shows up at input port as return loss mismatch. 5db hybrid splits the input power into 1:2 ratio wi th 90 degree phase difference. it can be used in asymmetrical (1:2) doherty power amplifier architec ture as splitter. 5db hybrid is also used in some symmetrical doherty power amplifier to compensate t he gain difference between main and peaking amplifiers. it is worth noting that 3db and 5db hyb rid react differently to the termination mismatch, resulting in different return loss at input port.
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 4328909 (800) 4116596 +44 2392232392 model x 3 c 19 p 1 - 05 s rev b packaging and ordering information parts are available in a reel and as loose parts in a bag. packaging follows eia 4812 for reels . p arts are oriented in tape and reel as shown below. minimum order quanti ties are 2000 per reel and 100 for loose parts.. s ee model numbers below for further ordering information. direction of part feed (unloading) dimensions are in inches[mm] xinger coupler frequency (mhz) size (inches) coupling value plating finish x3c 04 = 410500 07 = 600900 09 = 8001000 19 = 17002000 21 = 20002300 25 = 23002500 26 = 26502800 35 = 33003800 a = 0.56 x 0.35 b = 1.0 x 0.50 e = 0.56 x 0.20 l = 0.65 x 0.48 m= 0.40 x 0.20 p = 0.25 x 0.20 1 = 100 2 = 200 3 = 300 s = immersion tin xxx xx x x xx x 03 = 3db 05 = 5db 10 = 10db 20 = 20db 30 = 30db power (watts) example: x3c 19 p 1 03 s
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